The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Sep. 11, 2020
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Inventor:
Jia Liu, Yokohama Kanagawa, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 15/20 (2006.01);
U.S. Cl.
CPC ...
G01R 15/207 (2013.01); G01R 15/202 (2013.01);
Abstract
A chip package according to one embodiment includes a magnetic field sensor and a chip housing. The chip housing is a rectangular parallelepiped body. A solenoid coil is wound around four outer surfaces of the chip housing. The magnetic field sensor is disposed in the chip package. A plurality of first electrode pads connected to the solenoid coil and a plurality of second electrode pads connected to the magnetic field sensor are disposed on one mounting surface.