The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 28, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Benjamin Wunsch, Mt. Kisco, NY (US);

Sung-Cheol Kim, New York, NY (US);

Stacey Gifford, Fairfield, CT (US);

Joshua T. Smith, Croton-on-Hudson, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 21/66 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); H01L 21/68 (2013.01); H01L 22/12 (2013.01); G01N 2201/06113 (2013.01);
Abstract

Techniques regarding one or more structures for checking the via formation are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a microfluidic channel positioned on a silicon substrate. The apparatus can also comprise a pattern of material comprised within the microfluidic channel and positioned on a surface of the silicon substrate. Further, the pattern of material can define a future location of a through-silicon via. An advantage of such an apparatus can be that the pattern of material can facilitate checking whether the through-silicon via is fully or partially formed.


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