The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Mar. 25, 2019
Applicant:

Ricoh Company, Ltd., Tokyo, JP;

Inventors:

Tatsuru Moritani, Kanagawa, JP;

Naoki Shiraishi, Kanagawa, JP;

Tadahiko Morinaga, Kanagawa, JP;

Assignee:

Ricoh Company, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/14 (2006.01); B01J 2/06 (2006.01); B01J 2/18 (2006.01); C08F 14/22 (2006.01); C08G 63/08 (2006.01); C08J 3/11 (2006.01); B29B 9/12 (2006.01); B29B 9/10 (2006.01);
U.S. Cl.
CPC ...
C08J 3/14 (2013.01); B01J 2/06 (2013.01); B01J 2/18 (2013.01); C08F 14/22 (2013.01); C08G 63/08 (2013.01); C08J 3/11 (2013.01); B29B 9/10 (2013.01); B29B 9/12 (2013.01); B29B 2009/125 (2013.01);
Abstract

A method for manufacturing resin particles is provided. The method includes the steps of: dissolving a resin free of poly(lactic-co-glycolic acid) (PLGA) in a good solvent of the resin to prepare a resin solution; and discharging the resin solution from at least one discharge hole having an inner diameter of less than 1,000 μm into a poor solvent of the resin to form resin particles.


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