The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Oct. 05, 2017
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Tomoko Kato, Ichihara, JP;

Toyohiko Fujisawa, Ichihara, JP;

Harumi Kodama, Ichihara, JP;

Masayuki Onishi, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/12 (2006.01); C08K 3/013 (2018.01); C08G 77/08 (2006.01); C08G 77/20 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C08G 77/12 (2013.01); C08G 77/08 (2013.01); C08G 77/20 (2013.01); C08K 3/013 (2018.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); H01L 23/373 (2013.01);
Abstract

A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 μm; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 μm, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.


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