The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Jul. 19, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Katsuhiro Okubo, Azumino, JP;

Shigeki Suzuki, Shiojiri, JP;

Hiroyuki Hagiwara, Matsumoto, JP;

Takahiro Kanegae, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/04563 (2013.01); B41J 2/1433 (2013.01); B41J 2/14233 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/13 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01);
Abstract

A liquid ejecting head unit includes an ejecting surface in which nozzles for ejecting a liquid are formed, and a first and a second circuit substrates for ejecting the liquid from the nozzles, in which a planar shape of the ejecting surface includes a first, a second and a third portions. A center line parallel to a long side of a rectangle of a minimum area surrounding the ejecting surface passes the first portion but not the second and third portions. The second and third portions are arranged adjacently to the first portion interposed therebetween. The first circuit substrate is positioned in the first and second portions. The second circuit substrate is positioned in at least one of the first and third portions.


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