The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Jun. 30, 2017
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Shunichi Morishima, Tokyo, JP;

Toshio Kozasa, Tokyo, JP;

Masatake Hatano, Tokyo, JP;

Kazuaki Kishimoto, Tokyo, JP;

Yukio Takeuchi, Tokyo, JP;

Masahiko Matsuhashi, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/44 (2006.01); B32B 5/26 (2006.01); B32B 5/02 (2006.01); B29C 65/68 (2006.01); B29C 70/24 (2006.01); B29C 70/10 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B29C 65/68 (2013.01); B29C 70/24 (2013.01); B29C 70/443 (2013.01); B32B 5/024 (2013.01); B29C 70/10 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2262/14 (2013.01); B32B 2307/736 (2013.01);
Abstract

A joined member assembly method includes: a step in which a substrate is inserted in a gap between a superposed first component and a second component, said substrate being configured from a multilayer fabric that is capable of expanding as a result of heating and that is flexible after expansion and a reinforcing material woven into the multilayer fabric; a step in which the substrate is heated and made to expand in the thickness direction; a step in which the gap is filled with a resin and the substrate is impregnated with the resin; and a step in which the resin is cured. A step in which a seam is created by machining in accordance with a measured gap shape is omitted.


Find Patent Forward Citations

Loading…