The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Dec. 17, 2020
Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

Tanya Yvette Moore, Hurdle Mills, NC (US);

Ronald S. Cok, Rochester, NY (US);

David Gomez, Holly Springs, NC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); B29C 59/02 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); B41F 17/00 (2006.01); B29C 59/00 (2006.01); B29L 31/34 (2006.01); B41F 16/00 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 33/3842 (2013.01); B29C 59/002 (2013.01); B29C 59/02 (2013.01); B41F 17/00 (2013.01); H01L 21/6835 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); B29C 2059/023 (2013.01); B29C 2059/028 (2013.01); B29L 2007/001 (2013.01); B29L 2031/34 (2013.01); B41F 16/00 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81345 (2013.01); H01L 2224/81901 (2013.01); H01L 2224/81986 (2013.01);
Abstract

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.


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