The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Mar. 15, 2013
Applicant:

Cda Research Group, Inc., Pittsburgh, PA (US);

Inventors:

ChunLim Abbott, Pittsburgh, PA (US);

Dominic C. Abbott, Pittsburgh, PA (US);

Assignee:

CDA RESEARCH GROUP, INC., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 33/34 (2006.01); A61K 9/06 (2006.01); A61K 9/08 (2006.01); A61K 9/70 (2006.01); A61K 9/00 (2006.01); A61K 9/02 (2006.01); A61K 9/12 (2006.01); A61L 24/02 (2006.01); A61L 17/00 (2006.01);
U.S. Cl.
CPC ...
A61K 9/0034 (2013.01); A61K 9/0031 (2013.01); A61K 9/02 (2013.01); A61K 9/06 (2013.01); A61K 9/08 (2013.01); A61K 9/12 (2013.01); A61K 9/7084 (2013.01); A61K 33/34 (2013.01); A61L 17/005 (2013.01); A61L 24/02 (2013.01);
Abstract

A topical copper ion treatment in basic form comprises a copper ion-containing solution composed of a biocompatible solution containing copper ions obtained by leaching of the copper ions from copper metal into the solution. The copper ion-containing solution can be combined with various carriers to form various forms of the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings, skin patches, and suture material. A method of making the copper ion-containing solution involves placing solid copper metal in a quantity of a biocompatible solution and maintaining the solution at a specified temperature for a predetermined period of time during which copper ions leach from the copper metal into the solution, and thereafter separating the solution from the solid copper metal.


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