The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Jun. 23, 2021
Applicant:

Shenzhen KE Rui ER Te Electronics Technology Co., Ltd, Shenzhen, CN;

Inventor:

Jianming Zeng, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02K 1/20 (2006.01); H02J 50/00 (2016.01); H02J 7/02 (2016.01); H02J 7/00 (2006.01); H02J 50/10 (2016.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02J 7/0042 (2013.01); H02J 7/02 (2013.01); H02J 50/10 (2016.02); H02K 1/20 (2013.01); H05K 7/20154 (2013.01); H05K 7/20909 (2013.01);
Abstract

A wireless charger, charging assembly, matching assembly and bracket for electric equipment, including: cold conduction plate, power interface, wireless charging module, semiconductor cooling sheet and heat dissipation module; power interface couples with wireless charging module and semiconductor cooling sheet respectively; cold conduction plate includes first and second cold conduction surface, first cold conduction surface sticks to electronic equipment, second cold conduction surface covers semiconductor cooling sheet; when powered on, wireless charging module charges electronic equipment, semiconductor cooling sheet cools down electronic equipment, heat dissipation module dissipates heat from semiconductor cooling sheet. By arranging semiconductor cooling sheet on side of wireless charging module sticking to electronic equipment, cooling down electronic equipment; arranging heat dissipation module on another side, dissipating heat on another end, guarantee temperature balance of the semiconductor cooling sheet, having solved effectively problem of heat generation when wireless charging electronic equipment, and affecting charging efficiency.


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