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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11317541 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Jun. 23, 2020

Electronic component module, electronic component unit, and method for manufacturing electronic component module

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Shinichiro Kuroiwa, Nagaokakyo, JP;

Yukihiro Fujita, Nagaokakyo, JP;

Tadateru Yamada, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20463 (2013.01); H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/3442 (2013.01); H05K 7/20509 (2013.01); H01L 25/16 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

An electronic component module includes a second terminal electrode that is independent of a first terminal electrode in terms of potential. A second electronic component is mounted on a board, with a first surface thereof facing the board. A heat transfer portion is disposed on a second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. A heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.

Find Patent Forward Citations

Kuroiwa, Shinichiro. (2022). Electronic component module, electronic component unit, and method for manufacturing electronic component module (U.S. Patent No. 11317541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11317541

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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