The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 07, 2020
Applicant:

Cig Photonics Japan Limited, Kanagawa, JP;

Inventors:

Daisuke Noguchi, Tachikawa, JP;

Hiroshi Yamamoto, Inagi, JP;

Assignee:

CIG PHOTONICS JAPAN LIMITED, Sagamihara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/113 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/28 (2013.01); H05K 2201/10121 (2013.01);
Abstract

An optical module includes a photoelectric device and a flexible printed circuit board. The flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface. The first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion. The second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion.


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