The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Feb. 26, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Maurizio Galvano, Padua, IT;
Gianmaria Furlan, Padua, IT;
Andrea Logiudice, Montegrotto Terme, IT;
Franco Mignoli, Verona, IT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0239 (2021.01); H01S 5/02 (2006.01); H01S 5/026 (2006.01); G01S 7/481 (2006.01); H01S 5/042 (2006.01); H01S 5/0231 (2021.01); G01S 7/484 (2006.01); H01S 5/323 (2006.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01);
U.S. Cl.
CPC ...
H01S 5/0215 (2013.01); G01S 7/4813 (2013.01); G01S 7/4814 (2013.01); H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/0261 (2013.01); H01S 5/0428 (2013.01); G01S 7/484 (2013.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01); H01S 5/04257 (2019.08); H01S 5/32341 (2013.01);
Abstract
A laser diode module is described herein. In accordance with a first exemplary embodiment, the laser diode module includes a first semiconductor die including at least one electronic switch, and a second semiconductor die including at least one laser diode. The second semiconductor die is bonded on the first semiconductor die using a chip-on-chip connecting technology to provide electrical connection between the electronic switch and the laser diode.