The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 09, 2019
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Soeren Steudel, Oud-Heverlee, BE;

Alexander Mityashin, Heverlee, BE;

Eric Beyne, Heverlee, BE;

Maarten Rosmeulen, Ghent, BE;

Assignee:

IMEC vzw, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 27/146 (2006.01); H01L 33/06 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 25/0753 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14698 (2013.01); H01L 33/06 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An optical device and a method for fabricating an optical device are described. The optical device may be a light emitting diode (LED) device, e.g. a micro-LED (μLED) device, or a photodiode (PD) device, e.g. an imager. The method comprises processing, on a first semiconductor wafer, an array including a plurality of compound semiconductor LEDs or compound semiconductor PDs and a plurality of first contacts, each first contact being electrically connected to one of the LEDs or PDs. The method further comprises processing, on a second semiconductor wafer, a CMOS IC and a plurality of second contacts electrically connected to the CMOS IC. The method further comprises hybrid bonding the first semiconductor wafer to the second semiconductor wafer such that the plurality of LEDs or PDs are individually connected to the CMOS IC via the first and second contacts.


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