The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Oct. 29, 2019
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventors:

Xiaoliang Tang, Shanghai, CN;

Guanglong Chen, Shanghai, CN;

Naoki Tsuji, Shanghai, CN;

Hua Shao, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11568 (2017.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/762 (2006.01); H01L 27/02 (2006.01); H01L 27/12 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/1157 (2017.01); H01L 29/78 (2006.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11568 (2013.01); G11C 16/0466 (2013.01); H01L 21/02532 (2013.01); H01L 21/26513 (2013.01); H01L 21/2815 (2013.01); H01L 21/7624 (2013.01); H01L 27/0207 (2013.01); H01L 27/1157 (2013.01); H01L 27/1203 (2013.01); H01L 29/40117 (2019.08); H01L 29/42344 (2013.01); H01L 29/511 (2013.01); H01L 29/512 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66484 (2013.01); H01L 29/66833 (2013.01); H01L 29/7831 (2013.01); H01L 29/792 (2013.01);
Abstract

The present disclosure provides a SONOS memory structure and a manufacturing method therefor. The SONOS memory structure including a substrate and a select transistor gate and a memory transistor gate formed on the substrate, wherein the substrate is a composite substrate including a base silicon layer, a buried oxide layer and a surface silicon layer, wherein the upper portion of the base silicon layer has a memory transistor well region formed therein; the select transistor gate and the memory transistor gate are formed on the surface silicon layer; the select transistor gate comprises a first select transistor gate and a second select transistor gate, the first select transistor gate and the second select transistor gate are respectively located at two sides of the memory transistor gate, and are electrically isolated from the memory transistor gate by first spacers on both sides of the memory transistor gate.


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