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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11315897 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Aug. 25, 2020

Substrate having an insulating layer with varying height and angle

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Satoru Takaku, Yokohama Kanagawa, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H05K 1/00 (2006.01); B23K 31/02 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/14 (2013.01); H01L 23/3128 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 23/5329 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/81 (2013.01);
Abstract

A semiconductor package includes: a semiconductor element; a substrate provided with the semiconductor element on a first surface of the substrate, the substrate including a first wiring partially exposed on a second surface of the substrate opposite to the first surface; a first structure formed of an insulating film, or an insulating film and a metal portion, the first structure surrounding an exposed portion of the first wiring, the first structure having asymmetric height and angle; and a first electrode provided on the exposed portion of the first wiring.

Find Patent Forward Citations

Takaku, Satoru. (2022). Substrate having an insulating layer with varying height and angle (U.S. Patent No. 11315897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11315897

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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