The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Jun. 13, 2019
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Tzu-Ching Tsai, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5283 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01);
Abstract

An integrated circuit device includes a first substrate, a second substrate, a first expanding pad, a second expanding pad and a bonding structure. The first substrate is provided with a first conductive portion, the second substrate is provided with a second conductive portion, the first expanding pad is formed on the first conductive portion to provide a first expanded contact area, the second expanding pad is formed on the second conductive portion to provide a second expanded contact area, and the bonding structure is formed between the first substrate and the second substrate, wherein the first expanding pad is bonded to the second expanding pad.


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