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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11315867 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Jan. 07, 2020

External connection part of semiconductor module, semiconductor module, external connection terminal, and manufacturing method of external connection terminal of semiconductor module

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Hayato Nakano, Kofu, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01R 4/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01R 4/34 (2013.01);
Abstract

An external connection terminal of a semiconductor module is provided. The external connection terminal includes a conductor having an upper surface and a lower surface; a plated layer configured to cover the upper surface of the conductor; and a nut provided on the lower surface-side of the conductor for receiving a screw penetrating the conductor. The plated layer includes a low contact resistance region overlapping a region in which the nut is provided, and a high contact resistance region that is a region except the low contact resistance region, as seen from above, and the plated layer includes a convex portion and a concave portion on a surface in the high contact resistance region.

Find Patent Forward Citations

Nakano, Hayato. (2022). External connection part of semiconductor module, semiconductor module, external connection terminal, and manufacturing method of external connection terminal of semiconductor module (U.S. Patent No. 11315867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11315867

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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