logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11315848 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Dec. 04, 2019

Semiconductor device and method of manufacturing semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Isamu Nishimura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Zandra V Smith

Assistant Examiner:

Abbigale A Boyle

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/486 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 23/147 (2013.01); H01L 23/3735 (2013.01); H01L 25/0655 (2013.01); H01L 2021/60015 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81193 (2013.01);
Abstract

A semiconductor device, includes: a semiconductor element including an element main surface and an element back surface facing opposite sides in a thickness direction; a wiring part electrically connected to the semiconductor element; an electrode pad electrically connected to the wiring part; a sealing resin configured to cover a part of the semiconductor element; and a first metal layer configured to make contact with the element back surface and exposed from the sealing resin, wherein the semiconductor element overlaps the first metal layer when viewed in the thickness direction.

Find Patent Forward Citations

Nishimura, Isamu. (2022). Semiconductor device and method of manufacturing semiconductor device (U.S. Patent No. 11315848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11315848

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…