The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Feb. 12, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Taisuke Kanzaki, Nagaokakyo, JP;

Satoshi Muramatsu, Nagaokakyo, JP;

Kosuke Onishi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); H01G 4/2325 (2013.01);
Abstract

A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 μm or more and about 12 μm or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 μm or more.


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