The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Aug. 03, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kiyoshiro Ishibe, Nagaokakyo, JP;

Daisuke Hamada, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component having an electrode facing portion in which a plurality of internal electrode layers face one another with a dielectric layer interposed therebetween. Each dielectric layer includes Ba, Ti, Si, Re, and M. M is at least one element selected from Mn, Ni, Co, Fe, Cr, Cu, Mg, Li, Al, Mo, W, and V. When the Ti is represented in an amount of 100 parts by mole the dielectric layer at the electrode facing portion has Si in an amount a of 0.01≤a≤0.1, Re in an amount b of 0.1≤b≤3.0, and M in an amount c of 0.2≤c≤5.0. A ratio m of the amount of Ba to the amount of Ti is 0.965≤m≤0.990.


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