The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Apr. 30, 2020
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

Chris M. Helberg, Austin, TX (US);

Travis C. North, Cedar Park, TX (US);

Assignee:

Dell Products, L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G06F 1/18 (2006.01); G06F 13/42 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G06F 1/185 (2013.01); G06F 13/4282 (2013.01); H05K 7/20163 (2013.01); G06F 2213/0042 (2013.01);
Abstract

Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.


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