The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jul. 12, 2019
Applicant:
Technische Hochschule Ingolstadt, Ingolstadt, DE;
Inventors:
Assignee:
Technische Hochschule Ingolstadt, Ingolstadt, DE;
Primary Examiner:
Int. Cl.
CPC ...
G01N 25/00 (2006.01); G01K 7/00 (2006.01); G01N 25/18 (2006.01); G01K 3/04 (2006.01); G01K 3/10 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); G01K 3/04 (2013.01); G01K 3/10 (2013.01); G01R 31/2628 (2013.01); G01R 31/2635 (2013.01);
Abstract
A method for determining a thermal impedance of a sample device is described. According to the method, a sample device is heated to an initial temperature. A pulsed power including a sequence of pulses is applied to the sample device. Temperature of the sample device is measured in a time-dependent manner. A thermal impedance of the sample device is determined based on the temperature of the sample device and the pulsed power.
Elger, Gordon. (2022). Thermal analysis of semiconductor devices (U.S. Patent No. 11313819). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11313819
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile