The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 20, 2019
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Yoshikatsu Inagaki, Tokyo, JP;

Shinichi Ito, Tokyo, JP;

Kazuya Takahashi, Tokyo, JP;

Shuta Hikichi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0233 (2013.01); B23P 2700/09 (2013.01); F28D 15/0283 (2013.01); F28F 2255/18 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.


Find Patent Forward Citations

Loading…