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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11313468 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Jul. 24, 2018

Sealing method, assembly, and assembly manufacturing method

Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Hiroki Akamatsu, Tokyo, JP;

Koichi Nakamura, Tokyo, JP;

Assignee:

MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;

Attorneys:

Manabu Kanesaka

Benjamin Hauptman

Kenneth Berner

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/08 (2006.01); F16J 15/14 (2006.01); F16J 15/06 (2006.01); B32B 5/02 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); F16J 15/10 (2006.01);
U.S. Cl.
CPC ...
F16J 15/14 (2013.01); B32B 3/08 (2013.01); B32B 5/02 (2013.01); B32B 37/0076 (2013.01); B32B 37/12 (2013.01); B32B 37/1284 (2013.01); F16J 15/062 (2013.01); B32B 2255/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2305/08 (2013.01); F16J 15/061 (2013.01); F16J 15/102 (2013.01);
Abstract

The sealing method is for sealing between: a rear surface of a first component which is a composite material containing a reinforcing fiber and a resin; and a front surface of a second component facing the rear surface of the first component. The sealing method includes: a step (ST) in which a molded body is placed at a corner between the front surface and an end surface of the first component, with a first sealing material interposed therebetween; and a step (ST) in which a second sealing material is applied from the molded body up to the front surface of the second component.

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Akamatsu, Hiroki. (2022). Sealing method, assembly, and assembly manufacturing method (U.S. Patent No. 11313468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11313468

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