The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jun. 15, 2016
Applicant:
Valinge Innovation Ab, Viken, SE;
Inventors:
Darko Pervan, Viken, SE;
Peter Wingårdh, Viken, SE;
Göran Ziegler, Viken, SE;
Thomas Meijer, Viken, SE;
Assignee:
VALINGE INNOVATION AB, Viken, SE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E04C 2/26 (2006.01); B32B 21/04 (2006.01); B32B 5/02 (2006.01); B32B 33/00 (2006.01); B32B 38/08 (2006.01); B32B 13/06 (2006.01); B32B 13/14 (2006.01); B32B 13/12 (2006.01); B32B 27/06 (2006.01); B32B 15/02 (2006.01); B32B 15/08 (2006.01); B32B 13/02 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/24 (2006.01); E04F 15/10 (2006.01);
U.S. Cl.
CPC ...
E04C 2/26 (2013.01); B32B 5/02 (2013.01); B32B 5/028 (2013.01); B32B 13/02 (2013.01); B32B 13/06 (2013.01); B32B 13/12 (2013.01); B32B 13/14 (2013.01); B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 21/04 (2013.01); B32B 27/06 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 33/00 (2013.01); B32B 38/08 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/1027 (2013.01); B32B 37/24 (2013.01); B32B 2260/021 (2013.01); B32B 2260/026 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/062 (2013.01); B32B 2262/067 (2013.01); B32B 2305/38 (2013.01); B32B 2307/538 (2013.01); B32B 2307/554 (2013.01); B32B 2307/724 (2013.01); B32B 2311/00 (2013.01); B32B 2375/00 (2013.01); B32B 2419/04 (2013.01); B32B 2607/00 (2013.01); E04F 15/102 (2013.01); E04F 15/107 (2013.01);
Abstract
A method of forming a building panel or a surface element, including providing a substrate, applying a sub-layer on the substrate, applying a mesh structure on the sub-layer, and applying heat and pressure to the mesh structure such that the sub-layer at least partially fills meshes of the mesh structure. Also, to such a building panel and a surface element.