The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Aug. 31, 2018
Applicant:

Walter Ag, Tubingen, DE;

Inventors:

Veit Schier, Echterdingen, DE;

Wolfgang Engelhart, Metzingen, DE;

Assignee:

Walter AG, Tubingen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); B23C 5/00 (2006.01); C23C 14/32 (2006.01); C23C 14/35 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0641 (2013.01); B23C 5/006 (2013.01); C23C 14/325 (2013.01); C23C 14/35 (2013.01); C23C 28/044 (2013.01); C23C 28/048 (2013.01);
Abstract

A coated cutting tool and a process for the production thereof is provided. The coated cutting tool includes a substrate and a hard material coating, the substrate being selected from cemented carbide, cermet, ceramics, cubic boron nitride, polycrystalline diamond or high-speed steel. The hard material coating includes a (Ti,Al)N layer stack of alternately stacked (Ti,Al)N sub-layers. The layer stack has an overall atomic ratio of Ti:Al within the (Ti,Al)N layer stack within the range from 0.33:0.67 to 0.67:0.33, a total thickness of the (Ti,Al)N layer stack within the range from 1 μm to 20 μm, each of the individual (Ti,Al)N sub-layers within the (Ti,Al)N layer stack of alternately stacked (Ti,Al)N sub-layers having a thickness within the range from 0.5 nm to 50 nm, each of the individual (Ti,Al)N sub-layers within the (Ti,Al)N layer stack of alternately stacked (Ti,Al)N sub-layers being different in respect of the atomic ratio Ti:Al than an immediately adjacent (Ti,Al)N sub-layer, and other characteristics.


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