The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
May. 02, 2017
Sony Corporation, Tokyo, JP;
Shunichi Suwa, Kanagawa, JP;
Kunihiko Nagamine, Kanagawa, JP;
Masahiro Matsumoto, Kanagawa, JP;
Daisuke Yamaguchi, Kanagawa, JP;
Yoshio Goto, Kanagawa, JP;
Kyohei Yoshimitsu, Tokyo, JP;
SONY CORPORATION, Tokyo, JP;
Abstract
Provided is a material-fixing substrate that does not have to use copper as a catalyst because the substrate-bonding site includes a cyclic alkyne to form a covalent bond with a surface of the substrate, and therefore that can reduce damage to a cell, for example, in a case where a to-be-fixed material is the cell. The material-fixing substrate has a to-be-fixed material fixed thereon via a material-fixing agent. The material-fixing agent includes: a substrate-bonding site that forms a covalent bond with a surface of the substrate and includes at least a cyclic alkyne; a hydrophilic site that is bonded to the substrate-bonding site; a light-responsive site that is bonded to the hydrophilic site and changes the skeleton thereof by irradiation with light; and an attachment site to which the to-be-fixed material is attached.