The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 02, 2020
Applicant:

Avery Dennison Corporation, Glendale, CA (US);

Inventors:

Eric L. Bartholomew, Mill Hall, PA (US);

William L. Bottorf, Mill Hall, PA (US);

Kyle R. Heimbach, Millmont, PA (US);

Brandon S. Miller, Lock Haven, PA (US);

Michael T. Waterman, Chardon, OH (US);

Michael T. Zajaczkowski, Bellefonte, PA (US);

Qiang Luo, State College, PA (US);

Andrew P. Full, State College, PA (US);

Christopher E. Kohler, S. Williamsport, PA (US);

Assignee:

Avery Dennison Corporation, Glendale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09J 133/08 (2006.01); B01J 19/00 (2006.01); B01J 19/08 (2006.01); B01J 19/18 (2006.01); C08F 2/01 (2006.01); C09J 4/06 (2006.01); B01J 19/12 (2006.01); C08F 2/48 (2006.01); C08F 2/54 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); B01J 19/006 (2013.01); B01J 19/0066 (2013.01); B01J 19/085 (2013.01); B01J 19/123 (2013.01); B01J 19/18 (2013.01); C08F 2/01 (2013.01); C08F 2/48 (2013.01); C08F 2/50 (2013.01); C08F 2/54 (2013.01); C09J 4/06 (2013.01); B01J 2219/00094 (2013.01); B01J 2219/00768 (2013.01); B01J 2219/00779 (2013.01); B01J 2219/08 (2013.01);
Abstract

Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.


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