logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11312858 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Jun. 22, 2018

Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tatsuya Arisawa, Fukushima, JP;

Fumito Suzuki, Fukushima, JP;

Shunji Araki, Fukushima, JP;

Hirohisa Goto, Fukushima, JP;

Yuki Inoue, Fukushima, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 15/08 (2006.01); C08J 5/04 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/3492 (2006.01); C08K 5/5399 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 15/08 (2013.01); C08J 5/043 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/0066 (2013.01); C08K 5/34924 (2013.01); C08K 5/5399 (2013.01); C08K 5/544 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2457/08 (2013.01); C08J 2371/12 (2013.01);
Abstract

Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

Find Patent Forward Citations

Arisawa, Tatsuya. (2022). Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board (U.S. Patent No. 11312858). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11312858

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…