The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 11, 2018
Applicant:

Lotte Advanced Materials Co., Ltd., Yeosu-si, KR;

Inventors:

Jee Kwon Park, Uiwang-si, KR;

Ik Mo Kim, Uiwang-si, KR;

Nam Hyun Kim, Uiwang-si, KR;

Jung Ki Kim, Uiwang-si, KR;

Sang Hyun Hong, Uiwang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 64/06 (2006.01); C08J 7/12 (2006.01); C08L 69/00 (2006.01); C08K 3/32 (2006.01); C08K 5/103 (2006.01); C08K 5/50 (2006.01); C08K 3/22 (2006.01); C08K 3/40 (2006.01); C08K 7/14 (2006.01); C08K 5/42 (2006.01); C08K 13/02 (2006.01); C08K 5/134 (2006.01); C08K 5/526 (2006.01);
U.S. Cl.
CPC ...
C08J 7/123 (2013.01); C08G 64/06 (2013.01); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C08K 3/40 (2013.01); C08K 5/103 (2013.01); C08K 5/134 (2013.01); C08K 5/42 (2013.01); C08K 5/50 (2013.01); C08K 5/526 (2013.01); C08K 7/14 (2013.01); C08K 13/02 (2013.01); C08L 69/00 (2013.01); C08K 2003/222 (2013.01); C08K 2003/324 (2013.01); C08K 2003/328 (2013.01); C08L 2201/08 (2013.01);
Abstract

A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes: about 100 parts by weight of a thermoplastic resin; about 1 to about 30 parts by weight of an additive for laser direct structuring (LDS additive); about 0.01 to about 5 parts by weight of a hindered phenol-based compound; about 0.01 to about 10 parts by weight of a sodium phosphate salt; about 0.01 to about 5 parts by weight of a phosphite compound; about 0.01 to about 5 parts by weight of a sulfonate compound; and about 0.01 to about 10 parts by weight of a metal oxide, wherein a weight ratio of the hindered phenol-based compound, the sodium phosphate salt, the phosphite compound and the sulfonate compound to the metal oxide may range from about 2:1 to about 10:1. The thermoplastic resin composition has good properties in terms of plating reliability and thermal stability (discoloration resistance) and can secure good injection molding stability by suppressing gas generation upon injection molding.


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