The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Sep. 23, 2020
Applicant:

Sunovion Pharmaceuticals Inc., Marlborough, MA (US);

Inventors:

Julie A. Cardin, Hastings, MN (US);

Edward Emmett Chapdelaine, South St. Paul, MN (US);

Steven A. Rau, Farmington, MN (US);

Assignee:

Sunovion Pharmaceuticals Inc., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 75/58 (2006.01); B65B 9/00 (2006.01); B65D 75/50 (2006.01); B65D 75/30 (2006.01); B65D 75/52 (2006.01); B65B 7/02 (2006.01); B65B 9/02 (2006.01); B65B 61/00 (2006.01); B65B 61/06 (2006.01);
U.S. Cl.
CPC ...
B65D 75/5855 (2013.01); B65B 7/02 (2013.01); B65B 9/00 (2013.01); B65B 9/02 (2013.01); B65B 61/007 (2013.01); B65B 61/06 (2013.01); B65D 75/30 (2013.01); B65D 75/50 (2013.01); B65D 75/52 (2013.01); B65D 75/5805 (2013.01); B65D 75/5827 (2013.01);
Abstract

Embodiments include a package for containing and dispensing a product. The package includes first and second layers; a product seal zone where the first layer is joined to the second layer, the product seal zone having an inner perimeter that defines an unsealed pouch area for containing the product and an outer perimeter; and a header zone adjacent to the outer perimeter of the product seal zone. The header zone includes a first tab; a second tab; a first tab-cut in the first layer within an unsealed portion of the header zone; and a second tab-cut in the second layer within the unsealed portion of the header zone. Other embodiments are also included herein.


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