The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Apr. 22, 2019
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventor:

Kunihiko Arai, Owariasahi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60L 53/16 (2019.01); B60L 53/18 (2019.01); H01R 13/502 (2006.01); H01B 7/42 (2006.01); B60L 53/302 (2019.01); H01B 9/00 (2006.01);
U.S. Cl.
CPC ...
B60L 53/16 (2019.02); B60L 53/18 (2019.02); B60L 53/302 (2019.02); H01B 7/423 (2013.01); H01B 9/00 (2013.01); H01R 13/502 (2013.01); B60L 2240/36 (2013.01);
Abstract

A connector includes: an outer circumferential wall forming a recessed portion inside thereof, a counterpart connector being to be fitted into the recessed portion; a cylindrical portion provided inside the outer circumferential wall, having an inner circumferential surface, and configured to receive a counterpart terminal of the counterpart connector inside the inner circumferential surface; a terminal having a contact portion arranged inside the inner circumferential surface, the terminal being to be electrically connected to the counterpart terminal when the contact portion contacts the counterpart terminal; and a cooling mechanism having a heat absorption portion and a heat dissipation portion, the heat absorption portion being provided at a position opposite to the contact portion with respect to the inner circumferential surface. The cooling mechanism dissipates heat generated at the contact portion and transferred to the heat absorption portion through the inner circumferential surface, at the heat dissipation portion.


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