The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Apr. 10, 2019
Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Satoshi Kaji, Tokyo, JP;

Tsuneo Takano, Tokyo, JP;

Kazuhisa Ikeda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/46 (2006.01); B29C 70/18 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B29C 43/34 (2006.01); B32B 27/12 (2006.01); B29C 43/20 (2006.01); B32B 5/28 (2006.01);
U.S. Cl.
CPC ...
B29C 70/465 (2013.01); B29C 43/20 (2013.01); B29C 43/34 (2013.01); B29C 70/18 (2013.01); B32B 5/022 (2013.01); B32B 5/12 (2013.01); B32B 5/28 (2013.01); B32B 27/12 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01);
Abstract

This fiber-reinforced resin molded article has: a sheet molding compound layer; a continuous fiber reinforcing material layer; and a harrier layer, wherein the barrier layer is interposed between the sheet molding compound layer and the continuous fiber reinforcing material layer.


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