The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Feb. 23, 2017
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Ryoma Nomiyama, Satsumasendai, JP;

Junya Maegawa, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); C22C 1/05 (2006.01); C22C 29/04 (2006.01); B22F 3/16 (2006.01); B22F 5/00 (2006.01); B22F 3/10 (2006.01); B22F 7/00 (2006.01);
U.S. Cl.
CPC ...
B23B 27/14 (2013.01); B22F 3/162 (2013.01); B22F 5/00 (2013.01); B23B 27/148 (2013.01); C22C 1/05 (2013.01); C22C 29/04 (2013.01); B22F 3/10 (2013.01); B22F 7/00 (2013.01); B22F 2005/001 (2013.01); B22F 2302/15 (2013.01); B23B 2200/0471 (2013.01);
Abstract

The cutting insert may include a substrate including a first surface, a second surface, and a cutting edge. The substrate may include a hard phase and a binder phase, and the hard phase may include a first hard phase and a second hard phase. In X-ray diffraction analysis, a peak of the first hard phase may be observed on a higher angle side than a peak of the second hard phase. The second hard phase in the second surface may include a compressive residual stress of 150 MPa or more. A maximum height (Rz) in the second surface may be 0.2 to 1.5 μm. A maximum height of the cutting edge may be 2 to 30 times the maximum height in the second surface.


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