The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jan. 29, 2016
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Kristopher J Erickson, Palo Alto, CA (US);
Krzysztof Nauka, Palo Alto, CA (US);
Thomas Anthony, Palo Alto, CA (US);
Lihua Zhao, Palo Alto, CA (US);
Howard S Tom, Palo Alto, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/10 (2021.01); B33Y 10/00 (2015.01); C23C 18/30 (2006.01); C23C 24/08 (2006.01); C23C 24/10 (2006.01); B82B 1/00 (2006.01); B82B 3/00 (2006.01); C23C 18/08 (2006.01);
U.S. Cl.
CPC ...
B22F 10/10 (2021.01); B33Y 10/00 (2014.12); B82B 1/00 (2013.01); B82B 3/00 (2013.01); C23C 18/30 (2013.01); C23C 24/08 (2013.01); C23C 24/10 (2013.01); C23C 24/106 (2013.01); C23C 18/08 (2013.01);
Abstract
Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.