The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Aug. 09, 2019
Applicant:
Honda Motor Co., Ltd., Tokyo, JP;
Inventors:
Gugang Chen, Palo Alto, CA (US);
Shutang Chen, San Jose, CA (US);
Assignee:
HONDA MOTOR CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/16 (2006.01); B01J 23/89 (2006.01); B01J 35/02 (2006.01); B01J 35/10 (2006.01); B01J 37/04 (2006.01); B01J 37/03 (2006.01); B01J 37/06 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
B22F 9/16 (2013.01); B01J 23/8926 (2013.01); B01J 35/02 (2013.01); B01J 35/1061 (2013.01); B01J 35/1066 (2013.01); B01J 35/1071 (2013.01); B01J 35/1085 (2013.01); B01J 37/031 (2013.01); B01J 37/04 (2013.01); B01J 37/06 (2013.01); B22F 1/0044 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2304/10 (2013.01);
Abstract
A method for preparing copper-solver and copper-gold porous microsheets with specific pore sizes, the method including the steps of providing a solution of copper microsheets and adding a silver or gold solution under controlled temperature, the reaction conditions can be changed to determine pore sizes.