The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Aug. 25, 2016
Applicant:
Sandvik Intellectual Property Ab, Sandviken, SE;
Inventors:
Johan Sundstrom, Stockholm, SE;
Malin Martensson, Nacka, SE;
Assignee:
Sandvik Intellectual Property AB, Sandviken, SE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B29C 64/129 (2017.01); B01J 3/06 (2006.01); C04B 35/52 (2006.01); C04B 35/573 (2006.01); C04B 35/638 (2006.01); C04B 35/645 (2006.01); A61L 27/08 (2006.01); C04B 35/626 (2006.01); B32B 18/00 (2006.01); B33Y 80/00 (2015.01); C04B 35/63 (2006.01); E21B 10/46 (2006.01); E21B 10/55 (2006.01); B22F 10/10 (2021.01); C04B 35/117 (2006.01); C04B 35/58 (2006.01); C04B 35/634 (2006.01);
U.S. Cl.
CPC ...
B01J 3/062 (2013.01); A61L 27/08 (2013.01); B22F 10/10 (2021.01); B29C 64/129 (2017.08); B32B 18/00 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C04B 35/117 (2013.01); C04B 35/52 (2013.01); C04B 35/573 (2013.01); C04B 35/58071 (2013.01); C04B 35/6269 (2013.01); C04B 35/634 (2013.01); C04B 35/638 (2013.01); C04B 35/6316 (2013.01); C04B 35/645 (2013.01); C04B 35/6455 (2013.01); E21B 10/46 (2013.01); E21B 10/55 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/427 (2013.01); C04B 2235/428 (2013.01); C04B 2235/48 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/608 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/616 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/661 (2013.01); C04B 2235/725 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/85 (2013.01); C04B 2235/963 (2013.01); C04B 2235/9638 (2013.01); C04B 2237/363 (2013.01); C04B 2237/365 (2013.01); C04B 2237/582 (2013.01); C04B 2237/704 (2013.01);
Abstract
A lithography based method for the manufacture of diamond composite materials in which green bodies are prepared by a layer-by-layer construction with resulting green bodies de-bound and sintered to achieve a dense high hardness material.