The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Apr. 04, 2019
Applicant:

Medtronic Minimed, Inc., Northridge, CA (US);

Inventors:

Chi-En Lin, Van Nuys, CA (US);

David Probst, Chandler, AZ (US);

Mohsen Askarinya, Chandler, AZ (US);

Akhil Srinivasan, Pacific Palisades, CA (US);

Melissa Tsang, Sherman Oaks, CA (US);

Michael E. Miller, Culver City, CA (US);

Parisa Kamgar, Los Angeles, CA (US);

Assignee:

MEDTRONIC MINIMED, INC., Northridge, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/145 (2006.01); A61B 5/1486 (2006.01); G01N 27/327 (2006.01); C12Q 1/54 (2006.01); G01N 27/02 (2006.01); A61B 5/00 (2006.01); C12Q 1/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/14532 (2013.01); A61B 5/0004 (2013.01); A61B 5/1486 (2013.01); C12Q 1/002 (2013.01); C12Q 1/54 (2013.01); G01N 27/026 (2013.01); G01N 27/3271 (2013.01);
Abstract

The invention includes method and materials designed to measure the material properties (e.g. thickness) of layers of material in a sensor using non-Faradaic EIS (Electrochemical Impedance Spectroscopy) methods. The methods are non-destructive, very sensitive and rapid. Typically in these methods, an AC voltage is applied to the desired material layer while the output current and therefore impedance is measured. This voltage can be applied in multiple frequencies in sweep mode in order to detect both the material and, for example, the thickness of the target material. In this way, EIS allows the characterization of properties of various layers of material disposed in devices such as electrochemical glucose sensors.


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