The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
May. 30, 2019
Hong Heng Sheng Electronical Technology (Huaian)co., Ltd., Huaian, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Zu-Ai Li, Shenzhen, CN;
Si-Hong He, Shenzhen, CN;
Mei-Hua Huang, Shenzhen, CN;
Ning Hou, Shenzhen, CN;
Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd., Huaian, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A circuit board () includes an insulating base layer (), a first conductive circuit layer () disposed on the base layer (); a solder mask layer () covering the first conductive circuit layer () away from the base layer (), wherein the solder mask layer () defines a slot (), the slot () exposes a portion of the first conductive circuit layer (), the solder mask layer () includes a sidewall () at the slot (); and a cover film () covering the solder mask layer (), wherein the cover film () defines an opening (), the opening () corresponds to the slot () and exposes the solder pad (), the cover film () includes a covering portion () and a side reflecting portion (), the covering portion () is disposed on the solder mask layer (), the side reflecting portion () is connected to the covering portion () and covers the sidewall ().