The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Dec. 23, 2020
Applicant:

Amulaire Thermal Technology, Inc., New Taipei, TW;

Inventors:

Jhao-Siang Jheng, New Taipei, TW;

Chun-Lung Wu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H01L 21/302 (2006.01); H01L 23/52 (2006.01); H01L 23/528 (2006.01); H05K 3/00 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0044 (2013.01); H05K 1/056 (2013.01);
Abstract

A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.


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