The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Feb. 18, 2019
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, s-Gravenhage, NL;

Inventors:

Edsger Constant Pieter Smits, Eindhoven, NL;

Jan-Eric Jack Martijn Rubingh, Geldrop, NL;

Marco Barink, Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05K 1/0393 (2013.01); H05K 1/181 (2013.01); H05K 3/12 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/302 (2013.01);
Abstract

A method of manufacturing a curved electronic device () and resulting product. A patterned layer of non-conductive support material () is printed onto a thermoplastic substrate () to form a support pattern. An electrical circuit () is applied onto the support pattern (), wherein the electrical circuit () comprises circuit lines () comprising a conductive material () applied onto support lines () of the pattern and electrical components () applied onto support islands () of the pattern. A thermoforming process (P) is used for deforming (S) the substrate () while a relatively high resistance of the support material () to the deforming maintains a structural integrity of the electrical circuit ().


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