The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Aug. 03, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Guenter Gera, Leonberg, DE;

Klaus Kosbi, Reutlingen, DE;

Lars Vollmer, Stuttgart-Vaihingen, DE;

Matthias Lausmann, Murr, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/145 (2013.01); H01L 23/49805 (2013.01); H01L 23/49838 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H01L 2924/1532 (2013.01); H05K 2201/09772 (2013.01); H05K 2201/10719 (2013.01);
Abstract

The invention relates to a semiconductor component (), comprising a semiconductor chip (), a housing () and a connection point arrangement () having at least two rows () of planar connection points (), which are arranged on a bottom side of the housing () and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (), a first distance is specified between two adjacent first connection points (A) of a first row () of the connection point arrangement () and a second distance is specified between two adjacent second connection points (A) of a second row () of the connection point arrangement (), and the second connection points (A) of the second row () are offset to the first connection points (A) of the first row (). The invention also relates to a corresponding contacting assembly having such a semiconductor element () and a printed circuit board. The first distance at least between two adjacent first connection points (A) of the first row () of the connection point arrangement () corresponds to an intermediate space (C, D) between two contacts of the corresponding contact arrangement, in which intermediate space at least two conducting tracks () having functionally reliable dimensions and distances can be arranged.


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