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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11310910 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Mar. 09, 2018

Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Yoshihiro Yoneda, Ageo, JP;

Toshifumi Matsushima, Ageo, JP;

Toshihiro Hosoi, Ageo, JP;

Kenshiro Fukuda, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Frank J Vineis

Assistant Examiner:

Laura B Figg

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C08L 63/04 (2006.01); C08L 77/00 (2006.01); H01G 4/12 (2006.01); H01G 4/14 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C08L 63/04 (2013.01); C08L 77/00 (2013.01); H01G 4/1227 (2013.01); H01G 4/14 (2013.01); H05K 1/09 (2013.01); H05K 1/162 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2457/08 (2013.01); B32B 2457/16 (2013.01); C08L 2205/03 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Find Patent Forward Citations

Yoneda, Yoshihiro. (2022). Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor (U.S. Patent No. 11310910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11310910

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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