The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

May. 26, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Tienyow Liu, Santa Clara, CA (US);

Mingming Cai, San Jose, CA (US);

Raghu Narayan Challa, San Diego, CA (US);

Junsheng Han, Sunnyvale, CA (US);

Farhad Meshkati, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 52/36 (2009.01); H04B 17/336 (2015.01); H04L 1/00 (2006.01); H04W 52/24 (2009.01); H04W 72/04 (2009.01);
U.S. Cl.
CPC ...
H04W 52/367 (2013.01); H04B 17/336 (2015.01); H04L 1/0003 (2013.01); H04W 52/243 (2013.01); H04W 52/365 (2013.01); H04W 72/0413 (2013.01); H04W 72/0473 (2013.01);
Abstract

Wireless communication devices are adapted to utilize maximum permissible exposure requirements in determining uplink traffic grant allocations within wireless communication systems. According to one example, a wireless communication device can determine one or more candidate uplink duty cycles for a subsequent uplink transmission interval based at least in part on an MPE requirement, determine a maximum number of resource blocks per symbol and a maximum MSC index associated with each of the one or more candidate uplink duty cycles from a predefined MCS index table, and select a duty cycle, number of resource blocks per symbol, and MCS that facilitates a largest number of un-coded bits for the subsequent uplink transmission interval. Other aspects, embodiments, and features are also included.


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