IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11310444 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Jun. 11, 2020

Solid-state image pickup element, image pickup device, and method of manufacturing solid-state image pickup element

Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Harumi Tanaka, Kanagawa, JP;

Itaru Oshiyama, Kanagawa, JP;

Sozo Yokogawa, Kanagawa, JP;

Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;

Attorney:

Chip Law Group

Primary Examiner:

Antoinette T Spinks

Int. Cl.
CPC ...
H04N 5/341 (2011.01); G02B 1/118 (2015.01); G02B 5/20 (2006.01); G02B 5/26 (2006.01); H01L 31/10 (2006.01); H04N 5/369 (2011.01); H01L 27/146 (2006.01); H04N 5/232 (2006.01); H04N 5/225 (2006.01); H04N 5/235 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
H04N 5/341 (2013.01); G02B 1/118 (2013.01); G02B 5/20 (2013.01); G02B 5/26 (2013.01); H01L 27/1461 (2013.01); H01L 27/1462 (2013.01); H01L 27/1463 (2013.01); H01L 27/14603 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14645 (2013.01); H01L 27/14649 (2013.01); H01L 31/10 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/232 (2013.01); H04N 5/2354 (2013.01); H04N 5/23229 (2013.01); H04N 5/33 (2013.01); H04N 5/369 (2013.01); H01L 27/1464 (2013.01); H01L 27/14641 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01);
Abstract

Provided is a solid-state image pickup element that includes a pixel, a light-receiving-surface-sided trench, and a light-receiving-surface-sided shielding member. A plurality of protrusions is formed on the light-receiving surface of the pixel in the solid-state image pickup element. In addition, the light-receiving-surface-sided trench is formed around the pixel having the plurality of protrusions formed, at the light-receiving surface in the solid-state image pickup element. In addition, the light-receiving-surface-sided member is buried in the light-receiving-surface-sided trench formed around the pixel having the plurality of protrusions formed on the light-receiving surface in the solid-state image pickup element. In addition, the photoelectric conversion region of a near-infrared-light pixel expands to the surface side opposed to the light-receiving surface of the photoelectric conversion region of a visible-light pixel. In addition, a trench is further formed inside the pixel at a surface opposed to the light-receiving surface.

Find Patent Forward Citations

Loading…