The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jan. 29, 2020
Applicant:

Sensorview Co., Ltd., Gyeonggi-do, KR;

Inventors:

Byoung Nam Kim, Gyeonggi-do, KR;

Hong Il Yoo, Seoul, KR;

Assignee:

SENSORVIEW CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); D01D 5/00 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 9/06 (2006.01); H01Q 9/40 (2006.01); H01Q 13/10 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0435 (2013.01); D01D 5/0007 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 9/065 (2013.01); H01Q 9/40 (2013.01); H01Q 13/106 (2013.01); H01Q 23/00 (2013.01);
Abstract

Disclosed is a low-loss and flexible curved or orthogonal transmission line-integrated multi-port antenna for an mmWave band. The low-loss and flexible curved transmission line-integrated multi-port antenna includes a multi-port antenna portion which includes a plurality of single antennas and forms multi-ports and a transmission line portion which includes a plurality of transmission lines which correspond to the single antennas, respectively, are integrated with electricity feeding portions of the single antennas to which central conductors used as signal lines of the transmission lines correspond, and has a curved shape. Here, the single antennas each include a ground plate, a dielectric substrate, formed on the ground plate, a signal conversion portion formed on the dielectric substrate, and an electricity feeding portion formed on the dielectric substrate and connected to the signal conversion portion.


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