The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Mar. 11, 2020
Applicant:

Infineon Technologies Dresden Gmbh & Co. KG, Dresden, DE;

Inventors:

Ahmed Mahmoud, Munich, DE;

Rolf Weis, Dresden, DE;

Armin Willmeroth, Friedberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/808 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/808 (2013.01); H01L 29/0634 (2013.01); H01L 29/66901 (2013.01);
Abstract

A semiconductor device includes a layer stack with a plurality of first semiconductor layers of a first doping type and a plurality of second semiconductor layers of a second doping type complementary to the first doping type. A first semiconductor region of a first semiconductor device adjoins the first semiconductor layers. Each second semiconductor region of the first semiconductor device adjoins at least one of the second semiconductor layers, and is spaced apart from the first semiconductor region. A third semiconductor layer adjoins the layer stack and each first semiconductor region and each second semiconductor region. The third semiconductor layer includes a first region arranged between the first semiconductor region and the second semiconductor region in a first direction. A third semiconductor region of the first or the second doping type extends from a first surface of the third semiconductor layer into the first region.


Find Patent Forward Citations

Loading…