The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Dec. 11, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Effendi Leobandung, Stormville, NY (US);

Chun-chen Yeh, Clifton Park, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/32 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 21/311 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/02381 (2013.01); H01L 21/02428 (2013.01); H01L 21/02494 (2013.01); H01L 21/02543 (2013.01); H01L 21/02546 (2013.01); H01L 21/30604 (2013.01); H01L 21/31105 (2013.01); H01L 29/0847 (2013.01); H01L 29/16 (2013.01); H01L 29/20 (2013.01); H01L 29/32 (2013.01); H01L 29/66545 (2013.01); H01L 29/7851 (2013.01); H01L 29/7853 (2013.01);
Abstract

A method of forming the fin structure that includes forming a replacement gate structure on a channel region of the at least one replacement fin structure; and forming an encapsulating dielectric encapsulating the replacement fin structure leaving a portion of the replacement gate structure exposed. The exposed portion of the replacement gate structure is etched to provide an opening through the encapsulating dielectric to the replacement fin structure. The replacement fin structure is etched selectively to the dielectric to provide a fin opening having a geometry dictated by the encapsulating dielectric. Functional fin structures of a second semiconductor material is epitaxially grown on the growth surface of the substrate substantially filling the fin opening.


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