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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11309345 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Nov. 06, 2020

Protective film composition and method of manufacturing semiconductor package by using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Myoung-chul Eum, Asan-si, KR;

Hye-kyoung Lee, Suwon-si, KR;

Chang-kun Kang, Seoul, KR;

Jae-hyun Kim, Hwaseong-si, KR;

Kyeong-il Oh, Hwaseong-si, KR;

Seung-keun Oh, Hwaseong-si, KR;

Chi-hwan Lee, Hwaseong-si, KR;

Assignees:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

DONGJIN SEMICHEM CO., LTD., Hwaseong-si, KR;

Attorney:

F. Chau & Associates, LLC

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); H01L 27/146 (2006.01); H01L 21/78 (2006.01); C09D 133/08 (2006.01); C09D 133/14 (2006.01); H01L 21/683 (2006.01); C08F 220/30 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); C08F 220/1806 (2020.02); C08F 220/301 (2020.02); C08F 220/302 (2020.02); C08F 220/306 (2020.02); C09D 133/08 (2013.01); C09D 133/14 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 27/14627 (2013.01); H01L 27/14632 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); C08F 220/1807 (2020.02); C08F 220/1808 (2020.02); C08F 220/1811 (2020.02); C08F 220/1818 (2020.02); C08F 220/281 (2020.02); C08F 220/282 (2020.02); C08F 220/283 (2020.02); C08F 220/305 (2020.02); C08K 5/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R, R, and Ris a hydrogen atom or a methyl group; Ris a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and Ris a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

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