The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Nov. 11, 2019
Applicant:

Wuhan China Star Optoelectronics Technology Co., Ltd., Hubei, CN;

Inventor:

Pengfei Yu, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 27/1259 (2013.01);
Abstract

A method of manufacturing an array substrate and an array substrate are provided. The method includes steps of providing a first metallic layer, a semiconductor layer, a second metallic layer, a common electrode layer, a protecting layer, and a pixel electrode layer on a substrate in sequence. The semiconductor layer is electrically connected to a source electrode of the first metallic layer through a first via hole. Part of the semiconductor layer is electrically connected to a drain electrode of the second metallic layer. A touch electrode is electrically connected to a touch signal line through a second via hole. The pixel electrode layer is electrically connected to the drain electrode through a third via hole.


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Yu, Pengfei. (2022). Method of manufacturing array substrate and array substrate (U.S. Patent No. 11309337). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11309337

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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